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High speed chip-to-chip data transmission using the SLVS signaling method

机译:使用SLVS信令方法的高速芯片到芯片数据传输

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The MIPI (Mobile Industry Processor Interfaces) Alliance standardizes a number of interfaces inside a mobile device. The MIPI D-PHY is a scalable, low-power, high-speed physical layer upon which several MIPI standards, like camera and display interfaces, are based. It is using the SLVS signaling method. A test chip designed by Nokia Research Center Bochum proves now the potential of SLVS for high-speed and low-power data transmission. Whereas the bi-directional link runs up to 1.2 Gbps on an unshielded flex PCB, it still consumes less than 10mW in total. Four wires per direction transfer differential Strobe and Data signals. The chip has been designed as full custom, using Texas Instruments' latest 65nm process technology. The major building blocks are a serializer / deserializer, comma detection, physical media access as well as aditional control and test logic. The active chip area is 0.01mm~2. First samples have been extensively tested and show full functionality.
机译:MIPI(移动行业处理器接口)联盟标准化移动设备内的许多接口。 MIPI D-PHY是可扩展的低功耗,高速物理层,其中多个MIPI标准,如相机和显示接口,是基于的。 它使用SLVS信令方法。 由诺基亚研究中心波鸿设计的测试芯片现在证明了高速和低功耗数据传输的SLV的潜力。 虽然双向链路在非屏蔽的Flex PCB上运行高达1.2 Gbps,但总共仍然消耗不到10mW。 每个方向传输差分频闪和数据信号四根电线。 该芯片设计为完整的定制,使用德州仪器最新的65nm工艺技术。 主要构建块是序列化器/解串器,逗号检测,物理媒体访问以及标签控制和测试逻辑。 有源芯片面积为0.01mm〜2。 第一个样本已被广泛测试并显示全功能。

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