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Chip-to-chip signal transmission system and signal reception circuit

机译:芯片间信号传输系统及信号接收电路

摘要

The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal. The receiver receives the receiving-testing-coupling signal through the reception-metal-pad and outputs a receiving-testing signal according to the receiving-testing-coupling signal.
机译:本发明提供了芯片对芯片信号传输系统。通过发送金属焊盘和接收金属焊盘在第一芯片的发送器和第二芯片的接收器之间执行信号发送。发送器在接收到驾驶测试信号时,根据驾驶测试信号通过变速器金属板发送变速器测试耦合信号。第一芯片上的接收测试电路通过传输测试金属焊盘接收传输测试耦合信号,并根据传输测试耦合信号输出传输测试信号。当第二芯片上的驱动测试电路接收到该驱动测试信号时,根据该驱动测试信号通过接收测试金属焊盘发送接收测试耦合信号。接收器通过接收金属焊盘接收接收测试耦合信号,并根据接收测试耦合信号输出接收测试信号。

著录项

  • 公开/公告号US10422831B2

    专利类型

  • 公开/公告日2019-09-24

    原文格式PDF

  • 申请/专利权人 I-SHOU UNIVERSITY;

    申请/专利号US201715451429

  • 发明设计人 YU-JUNG HUANG;YAN-CEN LIOU;

    申请日2017-03-07

  • 分类号G01R31/28;H04B5;

  • 国家 US

  • 入库时间 2022-08-21 12:16:34

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