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Method for manufacturing thin-film transistor active device and thin-film transistor active device manufactured with same

机译:薄膜晶体管有源器件的制造方法以及由该方法制造的薄膜晶体管有源器件

摘要

The present invention provides a method for manufacturing thin-film transistor active device and a thin-film transistor active device manufactured with the method. The method includes providing a substrate; forming a gate terminal on the substrate through sputtering and masking operations; forming a gate insulation layer on the gate terminal through CVD; forming an oxide semiconductor layer on the gate insulation layer through sputtering and masking operations; forming a first protection layer on the oxide semiconductor layer through CVD, forming a metal layer on the first protection layer through sputtering, and forming a data line electrode through masking operation; forming a second protection layer on the first protection layer and the data line electrode through CVD and forming first, second, and third bridging holes through masking operation; forming a transparent conductive layer on the second protection layer through sputtering and patternizing the transparent conductive layer through masking operation.
机译:本发明提供了一种用于制造薄膜晶体管有源器件的方法以及利用该方法制造的薄膜晶体管有源器件。该方法包括提供衬底;通过溅射和掩膜操作在基板上形成栅极端子;通过CVD在栅极端子上形成栅极绝缘层;通过溅射和掩模操作在栅极绝缘层上形成氧化物半导体层;通过CVD在氧化物半导体层上形成第一保护层,通过溅射在第一保护层上形成金属层,通过掩膜操作形成数据线电极;通过CVD在第一保护层和数据线电极上形成第二保护层,并通过掩膜操作形成第一,第二和第三桥接孔;通过溅射在第二保护层上形成透明导电层,并通过掩模操作将透明导电层图案化。

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