首页> 外国专利> METHOD FOR MANUFACTURING THIN-FILM TRANSISTOR ACTIVE DEVICE AND THIN-FILM TRANSISTOR ACTIVE DEVICE MANUFACTURED THEREBY

METHOD FOR MANUFACTURING THIN-FILM TRANSISTOR ACTIVE DEVICE AND THIN-FILM TRANSISTOR ACTIVE DEVICE MANUFACTURED THEREBY

机译:制造薄膜晶体管有源器件的方法及由此制造的薄膜晶体管有源器件

摘要

Disclosed are a method for manufacturing a thin-film transistor active device and the thin-film transistor active device manufactured thereby. The method comprises: step 1, providing a substrate (20); step 2, forming a gate (22) on the substrate (20) by means of sputtering and photo-masking procedures; step 3, forming a gate insulating layer (23) on the gate (22) through chemical vapor deposition; step 4, forming an oxide semiconductor layer (24) on the gate insulating layer (23) through sputtering and photo-masking; step 5, forming a first protection layer (25) on the oxide semiconductor layer (24) through chemical vapor deposition, forming a metal layer on the first protection layer (25) through sputtering, and forming a data line electrode (26) through photo-masking; step 6, forming a second protection layer (27) on the first protection layer (25) and the data line electrode through chemical vapor deposition, and forming first, second and third bridging holes (272, 274, 276) through photo-masking; and step 7, forming a transparent conductive layer (28) on the second protection layer (27) through sputtering, and patterning the transparent conductive layer (28) through photo-masking to obtain the thin-film transistor active device.
机译:公开了一种用于制造薄膜晶体管有源器件的方法和由此制造的薄膜晶体管有源器件。该方法包括:步骤1,提供衬底(20);步骤2,通过溅射和光掩模工艺在衬底(20)上形成栅极(22);步骤3,通过化学气相沉积法在栅极(22)上形成栅极绝缘层(23)。步骤4,通过溅射和光掩模在栅极绝缘层(23)上形成氧化物半导体层(24)。步骤5,通过化学气相沉积在氧化物半导体层(24)上形成第一保护层(25),通过溅射在第一保护层(25)上形成金属层,并通过光致成像形成数据线电极(26)。 -掩蔽;步骤6,通过化学气相沉积在第一保护层(25)和数据线电极上形成第二保护层(27),并通过光掩模形成第一,第二和第三桥接孔(272、274、276)。步骤7,通过溅射在第二保护层(27)上形成透明导电层(28),并通过光掩模对透明导电层(28)进行构图,得到薄膜晶体管有源器件。

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