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Method for manufacturing a non-volatile semiconductor memory device having contact plug formed on silicided source/drain region

机译:制造具有形成在硅化的源极/漏极区域上的接触插塞的非易失性半导体存储器件的方法

摘要

A method for manufacturing a semiconductor device includes the steps of forming a flash memory cell provided with a floating gate, an intermediate insulating film, and a control gate, forming first and second impurity diffusion regions, thermally oxidizing surfaces of a silicon substrate and the floating gate, etching a tunnel insulating film in a partial region through a window of a resist pattern; forming a metal silicide layer on the first impurity diffusion region in the partial region, forming an interlayer insulating film covering the flash memory cell, and forming, in a first hole of the interlayer insulating film, a conductive plug connected to the metal silicide layer.
机译:一种用于制造半导体器件的方法,包括以下步骤:形成具有浮置栅极,中间绝缘膜和控制栅极的闪存单元;形成第一和第二杂质扩散区;热氧化硅衬底的表面和浮置器件。栅极,通过抗蚀剂图案的窗口在部分区域中蚀刻隧道绝缘膜;在部分区域中的第一杂质扩散区域上形成金属硅化物层,形成覆盖闪存单元的层间绝缘膜,并在层间绝缘膜的第一孔中形成连接至金属硅化物层的导电插塞。

著录项

  • 公开/公告号US8865546B2

    专利类型

  • 公开/公告日2014-10-21

    原文格式PDF

  • 申请/专利权人 TETSUYA YAMADA;

    申请/专利号US201213616806

  • 发明设计人 TETSUYA YAMADA;

    申请日2012-09-14

  • 分类号H01L21/336;H01L29/66;H01L21/311;H01L27/115;H01L29/788;H01L21/316;H01L21/285;H01L27/105;G11C16/04;H01L27/02;

  • 国家 US

  • 入库时间 2022-08-21 16:05:13

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