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METHOD AND SYSTEM FOR CONTROLLING CHIP INCLINATION DURING FLIP-CHIP MOUNTING
METHOD AND SYSTEM FOR CONTROLLING CHIP INCLINATION DURING FLIP-CHIP MOUNTING
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机译:翻转安装过程中控制芯片倾斜的方法和系统
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摘要
A method for alignment of a first substrate coupled to a second substrate includes determining an inclination angle for the first substrate or the second substrate due to warpage. The method includes determining a joint height difference based on the inclination angle and configuring a size for one or more bond pads based on the joint height difference.
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