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Method for automatic offset calculation for deposition of an aligned metal pattern onto selective emitter pattern and subsequent monitoring of alignment
Method for automatic offset calculation for deposition of an aligned metal pattern onto selective emitter pattern and subsequent monitoring of alignment
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机译:用于将对准的金属图案沉积到选择性发射极图案上并随后监视对准的自动偏移计算方法
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摘要
A method for calculating an offset value for aligned deposition of a second pattern onto a first pattern, comprising steps of: (a) loading a substrate with the first pattern on a surface of the substrate into a pattern recognition device at an original position inside the pattern recognition device; (b) determining a coordinate of a prescribed point of the first pattern by the pattern recognition device; (c) superimposing the second pattern onto the first pattern on the surface of the substrate; (d) bringing back the substrate with the first pattern and the second pattern into the original position inside the pattern recognition device; (e) determining a coordinate of a prescribed point of the second pattern by the pattern recognition device; wherein the prescribed point of the first pattern corresponds to the prescribed point of the second pattern; and (f) calculating the offset value between the first pattern and the second pattern.
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