Thermally enhanced semiconductor packages and related methods

摘要

A chip package having a lead frame and a molded portion. The lead frame includes a thermal pad and at least one electrode. The molded portion partially encapsulates the at least one electrode such that it is exposed on a top surface but not on a bottom surface. A bottom surface of the thermal pad is exposed for direct securement to an external heat sink. The molded portion is disposed between the at least one electrode and the heat sink to prevent a short circuit.