A NEW CONTACT SMART CARD PACKAGING METHOD

摘要

A contact smart card packaging method is provided comprising the following steps: (1) using CSP (Chip Scale Package) or WLCSP (Wafer Level Chip Scale Package) techniques processing the contact smart card chip wafer die which need to be packaged and the thickness of the processed contact smart card chip wafer die can not be more than 0.60 mm; (2) designing and manufacturing the corresponding carrier tape or carrier sheet according to the data of the chip size the corresponding welding spot etc. of the processed contact smart card chip wafer die obtained with CSP or WLCSP processing; (3) using traditional SMT (Surface mounted technology) techniques pasting the processed contact smart card chip wafer die obtained in the step (1) on the corresponding position of the carrier tape or carrier sheet obtained in the step (2). The packaging method uses the mature SMT techniques in the pasting process the reliability of processing is greatly improved at the same time the carrier tape production control requirements are more relaxed the form of the carrier tape or the carrier sheet is more diversified (which can be flaky) therefore the production costs are greatly reduced reliability is greatly improved.