首页> 外国专利> SMART CARD WITH CONTACT, SIM CARD, BANK CARD, METHOD OF PREVENTING OR LIMITING A METAL CHIP TERMINAL CONNECTION NOBLE OF A SMART CARD CONTACT BASE, AND SMART CARD CONTACT BASE

SMART CARD WITH CONTACT, SIM CARD, BANK CARD, METHOD OF PREVENTING OR LIMITING A METAL CHIP TERMINAL CONNECTION NOBLE OF A SMART CARD CONTACT BASE, AND SMART CARD CONTACT BASE

机译:带触点的智能卡,SIM卡,银行卡,防止或限制智能卡触点座的金属芯片端子连接的方法以及智能卡触点座

摘要

SMART CARD WITH CONTACT, SIM CARD, BANK CARD, IMPEDIMENT OR LIMITATION METHOD OF OXIDATION OF A NON-NOBLE METAL CHIP TERMINAL CONNECTION SURFACE FROM A SMART CARD CONTACT BASE, AND, SMART CARD CONTACT BASE IS a contact smart card 100, 101 having a contact card of the smart card 10 and an ehíjp IC 200, 300 is disclosed. The contact base of the smart card 10 includes a substrate of the circuit 12, a contact element of the card reader 14 on a first side 16 of the substrate of the circuit 12 and a connecting element 18 on a second side 20 of the substrate of the circuit 12. The contact element of the card reader 14 has an electrically conductive metal surface 30 and the contact element connection 18 has a chiji terminal connection surface 36 which is not a noble metal. The IC 200, 300 chip is preferably mounted by flip-chip on the second side 20 of the substrate of circuit 12 and electrically connected to the connection surface of the chiip terminal 36. Furthermore, the connection surface of the chip terminal is preferably a protective layer against conductive organometallic electrical corrosion.
机译:具有接触性的智能卡,SIM卡,银行卡,非贵金属芯片终端连接表面从智能卡接触底座的氧化的阻碍或限制方法,并且智能卡接触底座是具有以下特征的接触式智能卡100、101:公开了智能卡10的接触卡和电子IC 200、300。智能卡10的接触基座包括电路12的基板,在电路12的基板的第一侧16上的读卡器14的接触元件以及在电路的基板的第二侧20上的连接元件18。读卡器14的接触元件具有导电的金属表面30,并且接触元件连接件18具有不是贵金属的chiji端子连接表面> 36。 IC 200、300芯片优选地通过倒装芯片安装在电路12的基板的第二侧20上,并且电连接至芯片端子36的连接表面。此外,芯片端子的连接表面优选地是保护性的。层可抵抗导电的有机金属电腐蚀。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号