way of implementing three-dimensional designs for semiconductor technology

摘要

the subject of the invention is a way of three-dimensional (3d) models on transparent substrates, used in the technology of semiconductor. in this way, first substrate (1) covered layer nietransparentnu0105 for uv radiation (2), and in the layer of the known techniques performed an opening of size and shape.then is deposited layer transparent to uv radiation (6) and a layer that covers fotorezystu layer (7). in the layer (7), on the open exercises, the second hole of larger size, after which the hole is transferred to the transparent layer (6).opening is performed in the process of photolithography, exposure is carried out with the substrate, and the mask is placed on the substrate layer nietransparentna (2).