SEMICONDUCTOR DEVICE INCLUDING STACKED BUMPS FOR EMI/RFI SHIELDING

摘要

The present disclosure relates to a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device comprises: a substrate, a semiconductor die disposed above the substrate, and a bonding member. The substrate further comprises a bonding finger. The semiconductor die further comprises a first and an adjacent second bonding pads. The bonding member further comprises a single bonding wire having a ball disposed on a first end that electrically connects the first bonding pad and the second bonding pad and an opposite second end bonded directly on the bonding finger.