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MINIATURE HIGH DENSITY OPTO-ELECTRONIC PACKAGE

机译:微型高密度光电封装

摘要

A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.
机译:一种方法,包括通过各向异性导电膜(ACF)将电路耦合到光电封装,其中,所述光电封装被配置为通过所述耦合以大约10吉赫兹(GHz)至大约40的最大频率传输电信号。 GHz。一种设备,包括:光电封装,其包括多个第一电极;以及电路,其包括多个第二电极,其中,至少一个第一电极经由ACF耦合到至少一个第二电极,并且其中光电封装被配置为通过耦合以大约10 GHz至大约40 GHz的最大频率传送电信号。

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