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ADHESION LAYER TO MINIMIZE DILELECTRIC CONSTANT INCREASE WITH GOOD ADHESION STRENGTH IN A PECVD PROCESS
ADHESION LAYER TO MINIMIZE DILELECTRIC CONSTANT INCREASE WITH GOOD ADHESION STRENGTH IN A PECVD PROCESS
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机译:PECVD工艺中的粘合层,可最大程度地降低介电常数,并具有良好的粘合强度
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摘要
Embodiments of the present invention provide a film stack and method for depositing an adhesive layer for a low dielectric constant bulk layer without the need for an initiation layer. A film stack for use in a semiconductor device comprises of a dual layer low-K dielectric deposited directly on an underlying layer. The dual low-K dielectric consists of an adhesive layer deposited without a carbon free initiation layer.
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