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PECVD ADHESION LAYER TO MINIMIZE DILELECTRIC CONSTANT INCREASE WITH GOOD ADHESION STRENGTH IN A PECVD PROCESS
PECVD ADHESION LAYER TO MINIMIZE DILELECTRIC CONSTANT INCREASE WITH GOOD ADHESION STRENGTH IN A PECVD PROCESS
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机译:PECVD粘合层,可在PECVD工艺中最大程度地降低介电常数,并具有良好的粘合强度
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摘要
Embodiments of the present invention provide a method and film stack for depositing an adhesive layer for a low dielectric constant bulk layer, without the need for a starting layer. The film stack for use in a semiconductor device includes a double layer low-K dielectric deposited directly over the underlying layer. The low-K dielectric consists of an adhesive layer deposited without a carbon-free starting layer.
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