THROUGH-SILICON VIAS AND INTERPOSERS FORMED BY METAL-CATALYZED WET ETCHING

摘要

Methods for making a through-silicon via feature in a silicon substrate and related systems are formed with a noble metal structure on a silicon substrate support surface to generate silicon substrate contact regions that are in contact with or proximate to the noble metal structure; exposing at least a portion of the silicon substrate support surface and noble metal structure to an etchant to preferentially etch the silicon substrate contact regions compared to silicon substrate non-contact regions until the etch front reaches the silicon substrate bottom surface.