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SURFACE TREATED COPPER FOIL, COPPER-CLAD LAMINATE COMPRISING THE COPPER FOIL FOR A PRINTED CIRCUIT BOARD, PREPARATION METHOD OF THE PRINTED CIRCUIT BOARD, AND PREPARATION METHOD OF THE SURFACE TREATED COPPER FOIL
SURFACE TREATED COPPER FOIL, COPPER-CLAD LAMINATE COMPRISING THE COPPER FOIL FOR A PRINTED CIRCUIT BOARD, PREPARATION METHOD OF THE PRINTED CIRCUIT BOARD, AND PREPARATION METHOD OF THE SURFACE TREATED COPPER FOIL
Disclosed are an electrolytic copper foil including a contact surface facing an insulation resin base material, a surface treatment copper foil including an anti-corrosion layer arranged on the contact surface and a metal alloy selected from a group containing copper, nickel, zinc, chrome, and tungsten or in which zinc is separately included in the anti-corrosion layer, a copper-clad laminated plate for printed circuit boards including the copper foil, a method for manufacturing the printed circuit boards, and a method for manufacturing the surface treatment copper foil.
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