surface treated copper foil, copper-clad laminate comprising the copper foil for a printed circuit board, preparation method of the printed circuit board, and preparation method of the surface treated copper foil

摘要

Disclosed are an electrolytic copper foil including a contact surface facing an insulation resin base material, a surface treatment copper foil including an anti-corrosion layer arranged on the contact surface and a metal alloy selected from a group containing copper, nickel, zinc, chrome, and tungsten or in which zinc is separately included in the anti-corrosion layer, a copper-clad laminated plate for printed circuit boards including the copper foil, a method for manufacturing the printed circuit boards, and a method for manufacturing the surface treatment copper foil.