首页> 外国专利> METHOD FOR PRODUCING ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL PRODUCED BY THE METHOD, SURFACE-TREATED ELECTROLYTIC COPPER FOIL OBTAINED BY USING THE ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE USING THE SURFACE-TREATED ELECTROLYTIC COPPER FOIL, AND PRINTED CIRCUIT BOARD

METHOD FOR PRODUCING ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL PRODUCED BY THE METHOD, SURFACE-TREATED ELECTROLYTIC COPPER FOIL OBTAINED BY USING THE ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE USING THE SURFACE-TREATED ELECTROLYTIC COPPER FOIL, AND PRINTED CIRCUIT BOARD

机译:电解铜箔的制造方法,通过该方法制造的电解铜箔,使用电解铜箔得到的表面处理过的电解铜箔,使用经表面处理的多孔铜箔和经表面处理的多孔多孔铜箔

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic copper foil which has a lower profile and a higher gloss than a low-profile electrolytic copper foil that has been conventionally supplied to a market.;SOLUTION: The electrolytic copper foil has a profile with such an ultra-low surface roughness (Rzjis) as less than 1.0 m and a glossiness [Gs (60)] of 400 or higher both on the surface in the deposition side regardless of its thickness. The electrolytic copper foil is obtained by electrolyzing a sulfuric-acid-based cupric electrolyte solution containing 3-mercapto-1-propane sulfonate, and/or bis(3-sulfopropyl)disulfide, a polymer of a quarternary ammonium salt having a cyclic structure, and chlorine.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种电解铜箔,该电解铜箔的轮廓要比传统上向市场提供的低剖面电解铜箔的轮廓要低,光泽度要高。不论其厚度如何,在沉积侧的表面上的超低表面粗糙度(Rzjis)均小于1.0 m且光泽度[Gs(60)]均大于或等于400。电解铜箔是通过电解含有3-巯基-1-丙烷磺酸盐和/或双(3-磺丙基丙基)二硫化物(具有环状结构的季铵盐的聚合物)的硫酸基铜电解质溶液而得到的,版权:(C)2007,JPO&INPIT

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