The purpose of the present invention is to provide a method for producing a polyimide resin that produces a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature; to provide a method for producing a polyimide coating that produces a polyimide coating excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature; to provide a method for producing a polyamic acid solution that leads to a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature; and to provide a polyimide coating and a polyamic acid solution resulting from the methods. The polyimide resin is produced by heating at a certain temperature a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N,N-tetramethylurea.
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