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Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution

机译:聚酰亚胺树脂的制造方法,聚酰亚胺涂层的制造方法,聚酰胺酸溶液的制造方法,聚酰亚胺涂层和聚酰胺酸溶液

摘要

Provided is a method of producing a polyimide resin that produces a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature. The method of producing a polyimide resin according to the present invention includes heating at from 120°C to 350°C a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent comprising at least a compound (A) represented by the general formula (1), in which R 1 represents a hydrogen atom or a hydroxyl group, R 2 and R 3 independently represent a hydrogen atom or a C 1 to C 3 alkyl group, and R 4 and R 5 independently represent a C 1 to C 3 alkyl group.
机译:本发明提供一种聚酰亚胺树脂的制造方法,该聚酰亚胺树脂即使在较低温度下进行热处理,也具有耐热性和机械特性优异且介电常数低的聚酰亚胺树脂。本发明的聚酰亚胺树脂的制造方法包括将由四羧酸二酐成分和二胺成分在至少包含化合物(A)的溶剂中反应而得到的聚酰胺酸在120℃至350℃下加热。 R 1代表氢原子或羟基,R 2和R 3独立地代表氢原子或C 1至C 3烷基,R 4和R 5分别由通式(1)表示)代表C 1至C 3烷基。

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