Provided is a method of producing a polyimide resin that produces a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature. The method of producing a polyimide resin according to the present invention includes heating at from 120°C to 350°C a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent comprising at least a compound (A) represented by the general formula (1), in which R 1 represents a hydrogen atom or a hydroxyl group, R 2 and R 3 independently represent a hydrogen atom or a C 1 to C 3 alkyl group, and R 4 and R 5 independently represent a C 1 to C 3 alkyl group.
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