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Thermal Behavior Of Aromatic Polyamic Acids And Polyimides Containing Oxadiazole Rings

机译:含恶二唑环的芳族聚酰胺酸和聚酰亚胺的热行为

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Two aromatic polyimides and the corresponding precursors (polyamic acid), with oxadiazole andpara/meta phenoxyphenylene rings in the main chain, were synthesised and the structure - thermalproperties correlation was followed by dynamic mechanical analysis. Only for the poly(amic acid) withmeta-oriented rings, more flexible than that para-oriented ones, it was possible to emphasize partiallythe glass transition domain because the imidization reaction takes place with increasing temperature.Over 200oC the thermogram starts to monitor the characteristics for the emerging polyimide. Afrequency dependent experiment was performed to calculate the activation energy of the transitionlocalized under 200oC to establish its nature. Consecutive heating – cooling - heating cycles wereaccomplished with the aim to distinguish between the imidization process and α - transitions. Moreover,information on how the imidization process gets forward were obtained. The polymer chain loosesgradually the flexibility and the glass transition temperature corresponding to the residual poly(amicacid) shifts to higher temperature. All phenomena are discussed by deep cross-examination of thestorage modulus (E’), loss modulus (E’’) and loss factor tan δ variation with temperature.
机译:两种芳族聚酰亚胺和相应的前体(聚酰胺酸),以及恶二唑和 合成了主链中的对/间苯氧亚苯基环,并且结构-热 性能相关之后进行动态力学分析。仅适用于具有 面向元的环,比面向对象的环更灵活,可以部分强调 因为酰亚胺化反应随温度的升高而发生,所以它是玻璃化转变域的。 超过200oC时,热谱图开始监控新兴聚酰亚胺的特性。一种 进行频率依赖性实验以计算跃迁的活化能 在200oC以下进行本地化以确立其性质。连续加热–冷却–加热周期为 为了区分酰亚胺化过程和α-跃迁而完成。而且, 获得有关酰亚胺化过程如何进行的信息。聚合物链松动 逐渐地,柔性和玻璃化转变温度对应于残留的聚(酰胺 酸)转移到更高的温度。所有现象都将通过深入的交叉讨论来讨论。 储能模量(E’),损耗模量(E’)和损耗因子tanδ随温度变化。

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