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Thermal behavior of aromatic polyamic acids and polyimides containing oxadiazole rings

机译:芳族聚酰胺酸和含恶二唑环的聚酰亚胺的热行为

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摘要

Two aromatic polyimides and the corresponding poly(amic acid)s, with oxadiazole and para/meta phenoxyphenylene rings in the backbone, were synthesized and the structure - thermal properties correlation was followed by dynamic mechanical analysis. Concerning the poly(amic acid)s, the glass transition domain was emphasized only for the compound with meta-oriented rings because the process of imidization takes place with increasing temperature. A multiplex experiment was performed to calculate the activation energy of the transition localized under 200C. Consecutive heating-cooling-heating cycles were accomplished. All phenomena are discussed by cross-examination of the storage modulus (E'), loss modulus (E") and loss factor tan delta variation with temperature.
机译:合成了两个芳族聚酰亚胺和相应的聚(酰胺酸),它们在主链上带有恶二唑和对/间苯氧基苯撑环,并通过动态力学分析跟踪了结构-热性能的相关性。关于聚(酰胺酸),仅对具有间位环的化合物强调了玻璃化转变域,因为酰亚胺化过程随温度升高而发生。进行了多重实验以计算在200℃下局部化的跃迁的活化能。完成了连续的加热-冷却-加热循环。通过交叉检验储能模量(E'),损耗模量(E“)和损耗因数tanδ随温度变化来讨论所有现象。

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