首页> 外国专利> FABRICATION METHOD OF A MULTILAYER BY ELECTROPHORETIC DEPOSITION AND MULTILAYER FILMS AS A GAS BARRIER

FABRICATION METHOD OF A MULTILAYER BY ELECTROPHORETIC DEPOSITION AND MULTILAYER FILMS AS A GAS BARRIER

机译:电泳沉积和多层膜作为气体屏障的多层制备方法

摘要

The present invention relates to a fabrication method of multilayer films, including (a) a step of forming a layer of first particles by electrodeposition of dispersion, suspension or solution of first particles onto a conductive substrate in the presence of an electric field; and (b) a step of forming a layer of second particles by electrodeposition of dispersion, suspension or solution of second particles onto a layer of the first particles in the presence of an electric field, which forms a multilayer film having a variety of barrier characteristics on a conductive substrate through an electrodeposition process which can be applied to a large area, facilitate processes, and be conducted at low costs, and fabricates a barrier film with maximized barrier characteristics for moisture, oxygen and electric field by increasing the number of layers within the formed multilayer film using a vacuum forming process. The barrier films fabricated according to the fabrication method of the present invention show a uniform and good film quality, and can be improved to be suited to each of the characteristics such as heat resistance, moisture barrier properties, gas barrier properties, magnetic field barrier properties, etc. The present invention also relates to multilayer films fabricated according to the above fabrication method and gas barrier films using the same.
机译:多层膜的制造方法技术领域本发明涉及多层膜的制造方法,其包括:(a)在电场的存在下,通过将第一颗粒的分散液,悬浮液或溶液电沉积在导电性基板上而形成第一颗粒层的工序。 (b)通过在电场的存在下将第二粒子的分散液,悬浮液或溶液电沉积到第一粒子层上而形成第二粒子层的步骤,从而形成具有各种阻挡特性的多层膜通过电沉积工艺在导电基板上进行电镀,该工艺可应用于大面积,简化工艺并以低成本进行,并通过增加其中的层数来制造对水分,氧气和电场具有最大阻挡特性的阻挡膜使用真空成型工艺形成的多层膜。根据本发明的制造方法制造的阻挡膜显示出均匀且良好的膜质量,并且可以被改进以适合于诸如耐热性,防潮性,阻气性,磁场阻挡性的各个特性。本发明还涉及根据上述制造方法制造的多层膜和使用该多层膜的阻气膜。

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