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PRINTED CIRCUIT BOARD FOR SMART IC, METHOD FOR MANUFACTURING SAME, AND SMART IC CHIP PACKAGE
PRINTED CIRCUIT BOARD FOR SMART IC, METHOD FOR MANUFACTURING SAME, AND SMART IC CHIP PACKAGE
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机译:用于智能IC的印刷电路板,制造方法及其智能IC芯片封装
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摘要
The present invention has effects of reducing manufacturing costs and improving corrosion resistance and chemical resistance by providing a printed circuit board for a smart IC which comprises an insulating layer in which a through hole is formed; a circuit pattern layer made up of aluminum which is formed on the insulating layer; and a surface treatment layer formed by chemical conversion coating the circuit pattern layer.;COPYRIGHT KIPO 2014
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