Wireless interface probe card for high speed one-shot wafer test and semiconductor testing apparatus having the same

摘要

For the wafer probe area wireless interface that enables high-speed one-shot test by the wireless data transmission of the card and It discloses a semiconductor testing device comprising: The wireless interface probe card includes a substrate member and transport member. The substrate member is provided with a plurality of probe terminals are arranged at a constant pitch. To a one-shot testing the semiconductor chip arranged on the wafer, the probe terminals are direct contact with the respective pads are arranged with a constant pitch in a plurality of semiconductor chips arranged on a wafer. The transfer member is arranged on the substrate member, providing a test signal to the pad of the wafer through the probe terminals and the electrical characteristics to a wireless reception signal provided from the pads of the wafer through the probe terminals The outside of the transmitting radio.