STIFFNESS-GRADIENT STRETCHABLE SUBSTRATE, MANUFACTURING METHOD OF THE SAME SUBSTRATE, STRETCHABLE ELECTRONICS PACKAGE PRODUCED USING THE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME PACKAGE

摘要

The present invention relates to stretchable substrates, a stretchable electronics package, and a manufacturing method of the same. More specifically, provided are a stiffness-gradient stretchable substrate configured by sequentially stacking a middle stiffness polymer layer whose size is smaller than that of a low stiffness polymer layer and a high stiffness polymer layer onto the low stiffness polymer layer, and a stretchable electronics device package configured by the same.