Stretchable substrate with intercalating bumps and a substrate-delamination layer, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package

摘要

The present invention relates to a protrusion inserting type stretchable substrate with a substrate delamination layer, a method for manufacturing the same, a stretchable electronic device package produced using the stretchable substrate, and a method for manufacturing the same. At least one protrusion is formed on a first polymer layer, and the protrusion is inserted into a second polymer layer. A substrate delamination layer is interposed between the first polymer layer and the second polymer layer, thereby allowing the substrate delamination layer to be separated from the first polymer layer when applied with an external force, and tensile strain, due to an external force, of a second polymer, where a circuit is formed and an electronic part is mounted on, is mostly prevented.