首页>
外国专利>
DEVICE TO ALIGN SEMICONDUCTOR PACKAGE, DEVICE TO CUT AND ALIGN SEMICONDUCTOR PACKAGE, AND METHOD FOR CUTTING AND ALIGNING SEMICONDUCTOR PACKAGE
DEVICE TO ALIGN SEMICONDUCTOR PACKAGE, DEVICE TO CUT AND ALIGN SEMICONDUCTOR PACKAGE, AND METHOD FOR CUTTING AND ALIGNING SEMICONDUCTOR PACKAGE
展开▼
机译:用于对准半导体封装的设备,用于切割和对准半导体封装的设备以及用于切割和对准半导体封装的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Disclosed are a device to align a semiconductor package, a device to cut and align a semiconductor package, and a method for cutting and aligning a semiconductor package which align a semiconductor package on an alignment table. According to an embodiment of the present invention, a device to align a semiconductor package includes a first alignment table having a loading groove on which a semiconductor package is loaded and the position is aligned and a first loading unit having an unloaded area, on which the semiconductor package is not loaded, alternately formed along directions of an x-axis and a y-axis, and moving along a transfer rail of the first alignment table; a second alignment table having a loading groove on which the semiconductor package is loaded and the position is aligned and a second loading unit having an unloaded area, on which the semiconductor package is not loaded, alternately formed along directions of an x-axis and a y-axis, and moving along a transfer rail of the second alignment table; a loading picker absorbing and transferring the semiconductor package on the first alignment table or the second alignment table; a tray in which the semiconductor package absorbed and transferred by the loading picker is stored; and a transfer rail connection unit connecting the transfer rail of the first alignment table and the transfer rail of the second alignment table.;COPYRIGHT KIPO 2014
展开▼