Cu alloy bonding wire for semiconductor package

摘要

A Cu alloy bonding wire for a semiconductor package according to the present invention is to provide a Cu alloy bonding wire which reduces costs and maintains excellent bonding properties and reliability. The Cu alloy bonding wire for a semiconductor package includes 0.2-2.0 wt% of Pd, 0.0005-0.05 wt% of elements selected among first additives of Au, Ag, and Pt, 0.0005-0.01 wt% of elements selected among second additives of Ca, Sn, and P, and the remainder of Cu. A wire drawing process is carried out by performing the metal coating of Au, Ag, Pt or their alloy on a surface in order to improve functions.