首页> 外国专利> METHOD lapping ORIENTATION substrates for epitaxy DIAMOND

METHOD lapping ORIENTATION substrates for epitaxy DIAMOND

机译:方法研磨取向衬底用于外延金刚石

摘要

Method finishing orientation substrates for epitaxy of diamond, comprising the steps of a method for finishing of orientation plates semiconductor and optical materials, comprising fixing the single crystal substrate in the mandrel rotator configured to smooth rotation about the axis in two mutually perpendicular directions with fixing and controlled rotation angle , characterized in that on the original surface of the substrate is polished edge correction platform at a predetermined angle of misorientation from the selected face Measured pad topography with an optical profilometer with a vertical resolution of better than 1 nm, compared predetermined and actual angles, and in case of discrepancies produce substrate twist on the corrected angle at which the polished whole growth surface, wherein the area of ​​the correction site is located within 1-5% of the total area to be finishing the edge, which allows fine-tuning of the orientation of the single-crystal substrate without re-installation and perepolirovok with accuracy rates of division vernier protractor.
机译:修整用于金刚石外延的定向基板的方法,其包括修整定向板半导体和光学材料的方法的步骤,包括将单晶基板固定在心轴旋转器中,该心轴旋转器通过固定和旋转在两个相互垂直的方向上绕轴平滑旋转。受控的旋转角度,其特征在于,在基板的原始表面上以距选定面预定方向的错位角度对抛光的边缘校正平台进行抛光,并使用光学轮廓仪测量垫形貌,垂直分辨率优于1 nm,与预定和实际相比角度,并且在出现差异的情况下会在抛光后的整个生长表面的校正角度上产生基板扭曲,其中校正部位的面积位于总面积的1-5%以内,以修整边缘,这允许无需重新安装即可微调单晶衬底的取向llation和perepolirovok以及游标量角器的准确率。

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号