FIELD: machine building.;SUBSTANCE: invention can be used in manufacturing of diamond cutoff wheels for cutting of hard and brittle materials such as ruby, sapphire, ceramics. A wheel comprises a disk casing with grooves for the depth of (0.05-0.1) of the diamond wheel width being made on its side surfaces. The grooves profile is shaped according to a curve specified by an equation which defines a current curve angle read from the curve start on the wheel periphery, depending on the current curve radius, diamond wheel radius, curve end radius and diamond layer height. Afterwards the diamond layer is electrodeposited on the wheel casing.;EFFECT: increased durability of a diamond cutoff wheel by 2 times as compared to a known wheel.;3 dwg, 1 tbl
展开▼
