Method for producing three dimensional structure of integrated circuit, involves introducing coarse structure of three dimensional structure by unit of two dimensional surface in lithography of lithography sensitive material

摘要

The method involves introducing fine structure (20) of the three dimensional structure by unit of a three dimensional lithography in a lithographic photosensitive material (11). The coarse structure (15) of the three dimensional structure is introduced by unit of the two dimensional surface in the lithography of lithography sensitive material. The coarse structure of a substrate (10) and coarse structure are spaced apart from each other due to separating region (19) in the lithography-sensitive material. Independent claims are included for the following: (1) apparatus for producing three dimensional structure; and (2) substrate.