Ball grid array (bga) and printed circuit boards (pcbs), to reduce -via-grid differential mode-crosstalk between the differential transmission and -receiving-signal pairs

摘要

A ball grid array (bga) and via grid contains a printed circuit board (pcb), which has a surface on which a plurality of regions are formed and a differential transmitter (tx) and receiving cluster (rx) is a differential send signal pair and has a differential received signal pair, which, by means of at least a portion of said plurality of regions on the surface of the pcb are formed, wherein the differential send signal pair and the differential received signal pair node, which are arranged in a diagonal orientation, in which each node of the differential received signal pair is equidistant to each node of the differential send signal pair is.