PROBLEM TO BE SOLVED: To provide a tablet molding mold which can take out a tablet easily without attaching a curable composition to a mold and, further, can provide a tablet for an optical semiconductor device having a preferable appearance.;SOLUTION: A tablet molding mold includes a first pestle 2, a second pestle 3 and a mortar 4 having a through-hole 4a to which the first pestle 2 and the second pestle 3 can be inserted and a curable composition for an optical semiconductor device is filled upon molding. Therein, the first pestle 2 is brought into contact with one side of the curable composition filled into the through-hole 4a, the second pestle 3 is brought into contact with the other side of the curable composition filled into the through-hole, thereby, the tablet for the optical semiconductor device can be molded, a Vickers hardness of the inner surface of the through-hole 4a brought into contact with the filled curable composition is Hv1100 or more and surfaces of the first pestle 2 and the second pestle 3 respectively brought into contact with the filled curable composition are subjected to releasing treatment.;COPYRIGHT: (C)2015,JPO&INPIT
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