Au-Sn-Ag TYPE SOLDER ALLOY, ELECTRONIC PARTS SEALED BY USING Au-Sn-Ag TYPE SOLDER ALLOY AND ELECTRONIC PARTS MOUNTED DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a Pb-free Au-Sn-Ag type solder alloy for high temperature which is excellent in processability, stress relaxation property, etc., has a suitable melting point, has an extremely small amount of Au content of about 50 mass% or less and thus is low cost, has a preferable melting point between Au-Ge solder alloy and Au-Sn solder alloy and, additionally, has satisfactory wettability upon a practical use.;SOLUTION: An Au-Sn-Ag type solder alloy contains Sn of more than 38.0 mass% and 43.0 mass% or less, contains Ag of 12.5 to 15.0 mass% and has the remainder constituted with Au. Further, the Au-Sn-Ag type solder alloy preferably contains at least any one kind of Al, Cu, Ge, In, Mg, Ni, Sb, Zn and P.;COPYRIGHT: (C)2015,JPO&INPIT