BALL-SHAPED Au-Sn-Ag TYPE SOLDER ALLOY, ELECTRONIC PART SEALED BY USING BALL-SHAPED Au-Sn-Ag TYPE SOLDER ALLOY AND ELECTRONIC PART MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a ball-shaped Au-Sn-Ag type solder alloy which is excellent in a wet-spreading property and joint property, is also excellent in processability, a stress relaxation property or the like, has a suitable melting point, has a low Au content, has a low cost and is lead-free for high temperature.;SOLUTION: A ball-shaped Au-Sn-Ag type solder alloy has such a shape as to be an aspect ratio of 1.00 to 1.20, contains Sn of 27.5 mass% or more and less than 33.0 mass%, contains Ag of 8.0 to 14.5 mass% and the remainder comprising Au besides elements inevitably contained upon manufacture.;COPYRIGHT: (C)2015,JPO&INPIT