BALL-SHAPED Au-Sn-Ag BASED SOLDER ALLOY, AND ELECTRONIC COMPONENT ENCAPSULATED USING THE BALL-SHAPED Au-Sn-Ag BASED SOLDER ALLOY AND DEVICE MOUNTED WITH ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a ball-shaped Au-Sn-Ag based solder alloy for high temperature which can be satisfactorily used even for bonding of an electronic component and a device mounted with an electronic component requiring extremely high reliability, such as a quartz device, am SAW filter and MEMS, has a melting point of 240 to 300°C, moreover, is excellent in particular in wettability and spreadability and in bonding property, further, has a low cost and is excellent in workability, stress relaxation property and reliability.SOLUTION: There is provided the ball-shaped Au-Sn-Ag based solder alloy which has such a shape that an aspect ratio (that is "major axis/minor axis" or "length side/width side" hereinafter the same) is 1.00 to 1.20 and which contains 55.0 to 70.0 mass% of Sn, 2.0 to 9.0 mass% of Ag and the balance comprised of Au with elements inevitably contained during production.SELECTED DRAWING: Figure 1