EVAPORATION SOURCE FOR VACUUM DEPOSITION APPARATUS, AND VACUUM VAPOR DEPOSITION APPARATUS AND VACUUM DEPOSITION METHOD USING THE EVAPORATION SOURCE

摘要

PROBLEM TO BE SOLVED: To provide a linear evaporation source capable of attaining a film thickness distribution of excellent reproducibility over a long time running from a processing start in a long evaporation source.;SOLUTION: A first feature of the invention is a first finding described in the problem, that is, to provide vapor generation suppression-reducing means for reducing the vapor generation suppression phenomenon occurring in a longitudinal direction. Furthermore, a second feature of the invention is a second finding described in the problem that since the vapor having passed an orifice is sucked/released into/from a near nozzle without sufficiently diffusing in the longitudinal direction under a high vacuum, when only disposing a rectification plate simply, and in order to avoid the suction/release, there is provided vapor diffusing means for diffusing the generated vapor in the longitudinal direction.;COPYRIGHT: (C)2015,JPO&INPIT