Solder preform and solder alloy assembly method

摘要

A method of assembling a component such as an electronic component on a substrate such as an electronic substrate includes applying a solder paste to the electronic substrate to form a solder paste deposit, and placing a low-temperature preform on the solder paste deposit Treating the electronic substrate at a solder paste reflow temperature to form a low temperature solder joint; and treating the low temperature solder joint at a reflow temperature lower than the solder paste reflow temperature. Other methods of assembling the component and the solder joint composition are further disclosed.