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Electronic component lead terminal, electronic component, electronic component lead terminal manufacturing method, and electronic component lead terminal manufacturing apparatus

机译:电子零件引线端子,电子零件,电子零件引线端子的制造方法以及电子零件引线端子的制造装置

摘要

An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.
机译:电子部件引线端子包括:引线端子,其一端可连接至电子部件,另一端可与电极连接;以及防焊锡芯吸区域,其形成在该引线端子的表面上,以便与从另一端朝向一端的焊料芯吸方向相交,该焊料芯吸防止区域包括在焊料芯吸方向上向下游侧突出的多个部分。

著录项

  • 公开/公告号JP5793902B2

    专利类型

  • 公开/公告日2015-10-14

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP20110061819

  • 发明设计人 田村 浩晃;十倉 史彦;

    申请日2011-03-19

  • 分类号H01L23/50;B23K1;B23K101/42;

  • 国家 JP

  • 入库时间 2022-08-21 15:32:25

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