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METHOD OF PROCESSING COPPER SURFACE TO ENHANCE ADHESION TO ORGANIC SUBSTRATE FOR USE IN PRINTED CIRCUIT BOARD
METHOD OF PROCESSING COPPER SURFACE TO ENHANCE ADHESION TO ORGANIC SUBSTRATE FOR USE IN PRINTED CIRCUIT BOARD
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机译:处理铜表面以增强对印刷电路板中使用的有机基质的粘附力的方法
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摘要
PROBLEM TO BE SOLVED: To provide a printed circuit board (PCB) or a printed wiring board (PWB) obtained by processing a smooth copper surface so as to enhance adhesion between the copper surface and an organic substrate.;SOLUTION: A copper oxide layer includes a plurality of particles having the size of approximately 250 nm or less; the particles are oriented in a substantially irregular manner; and the copper oxide layer has the surface having roughness of approximately 0.14 μm Ra or less. A printed circuit board includes at least one copper layer, at least one polymer material layer, and a stabilization layer between the copper layer and the polymer material layer; the stabilization layer includes a plurality of particles having the size of approximately 250 nm or less; and the particles are oriented in a substantially irregular manner.;COPYRIGHT: (C)2015,JPO&INPIT
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