METHOD OF PROCESSING COPPER SURFACE TO ENHANCE ADHESION TO ORGANIC SUBSTRATE FOR USE IN PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board (PCB) or a printed wiring board (PWB) obtained by processing a smooth copper surface so as to enhance adhesion between the copper surface and an organic substrate.;SOLUTION: A copper oxide layer includes a plurality of particles having the size of approximately 250 nm or less; the particles are oriented in a substantially irregular manner; and the copper oxide layer has the surface having roughness of approximately 0.14 μm Ra or less. A printed circuit board includes at least one copper layer, at least one polymer material layer, and a stabilization layer between the copper layer and the polymer material layer; the stabilization layer includes a plurality of particles having the size of approximately 250 nm or less; and the particles are oriented in a substantially irregular manner.;COPYRIGHT: (C)2015,JPO&INPIT