首页> 外国专利> Addition-curable silicone resin composition, addition-curable silicone resin cured product, and optical semiconductor element encapsulant

Addition-curable silicone resin composition, addition-curable silicone resin cured product, and optical semiconductor element encapsulant

机译:可加成固化的有机硅树脂组合物,可加成固化的有机硅树脂固化产物和光学半导体元件密封剂

摘要

An object of the present invention is to provide an addition-curable silicone resin composition excellent in interfacial adhesion, storage stability, and transparency. Moreover, an object of this invention is to provide the addition curable silicone resin hardened | cured material and optical semiconductor element sealing body which use this addition curable silicone resin composition. The present invention is an addition curable silicone resin composition comprising an addition curable silicone resin mixture and an adhesion promoter, wherein the addition curable silicone resin mixture has a refractive index of 1.35 to 1.45. And the adhesion-imparting agent is represented by the following formula (1-3) between the structural unit represented by the following formula (1-1) and the structural unit represented by the following formula (1-2). An addition-curable silicone resin composition comprising a structural unit represented by formula (1-4) below and / or a compound having a refractive index of 1.35 to 1.45. . In Formula (1-1) and Formula (1-2), R 1a independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, or an aralkyl group. In formula (1-3) and formula (1-4), R 1b independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, or an aralkyl group. In formula (1-3), m is an integer of 1-50, and in formula (1-4), n is an integer of 1-1500. In formulas (1-1) to (1-3), each A is independently represented by an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, or the following formula (2). It is a group. However, in formulas (1-1) to (1-3), at least one A is a group represented by formula (2). In formula (2), R2a represents a C1-C8 alkylene group in which some of the carbon atoms excluding the carbon atom bonded to the silicon atom may be substituted with an oxygen atom, and R2b each independently Represents an alkylene group having 1 to 3 carbon atoms, R 3 independently represents an alkylene group having 1 to 3 carbon atoms, and R 4 each independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, OH Represents a C 1-3 alkyl group having a group or a halogeno group. In formula (2), x is an integer of 0-2. [Chemical 1] [Chemical 2]
机译:本发明的目的是提供界面粘合性,保存稳定性和透明性优异的可加成固化的有机硅树脂组合物。另外,本发明的目的是提供一种硬化的加成固化性有机硅树脂。使用该加成固化性有机硅树脂组合物的固化物和光半导体元件密封体。本发明是一种可加成固化的有机硅树脂组合物,包括可加成固化的有机硅树脂混合物和增粘剂,其中该可加成固化的有机硅树脂混合物的折射率为1.35-1.45。并且,在下式(1-1)表示的结构单元与下式(1-2)表示的结构单元之间,下式(1-3)表示增粘剂。一种可加成固化的有机硅树脂组合物,其包含以下式(1-4)表示的结构单元和/或折射率为1.35至1.45的化合物。 。在式(1-1)和式(1-2)中,R 1a独立地表示具有1至18个碳原子的烷基,环烷基,芳基或芳烷基。在式(1-3)和式(1-4)中,R 1b独立地表示具有1至18个碳原子的烷基,环烷基,芳基或芳烷基。式(1-3)中,m是1〜50的整数,式(1-4)中,n是1〜1500的整数。在式(1-1)至(1-3)中,每个A独立地由具有1至18个碳原子的烷基,环烷基,芳基,芳烷基或下式(2)表示。这是一个团体。然而,在式(1-1)至(1-3)中,至少一个A是由式(2)表示的基团。式(2)中,R 2a表示碳原子数为1〜3的亚烷基,R 2b分别独立地表示碳原子数为1〜3的亚烷基。碳原子,R 3独立地表示具有1至3个碳原子的亚烷基,R 4各自独立地表示氢原子,具有1至3个碳原子的烷基,OH代表具有一个或多个碳原子的C 1-3烷基。卤代基团。在公式(2)中,x是0-2的整数。 [化学1] [化学2]

著录项

  • 公开/公告号JP5716139B1

    专利类型

  • 公开/公告日2015-05-13

    原文格式PDF

  • 申请/专利权人 住友精化株式会社;

    申请/专利号JP20140545990

  • 发明设计人 福田 矩章;眞田 翔平;山本 勝政;

    申请日2014-06-27

  • 分类号C08L83/07;C08L83/05;C08G77/388;C08L83/08;H01L23/29;H01L23/31;H01L33/52;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:49

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号