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Monolithic integration of CMOS and non-silicon elements
Monolithic integration of CMOS and non-silicon elements
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机译:CMOS和非硅元件的单片集成
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摘要
The method includes attaching a partially processed CMOS wafer to a second wafer to produce a bonded wafer. The second wafer comprises a first region comprising a material different from silicon. The method also includes forming a device in a first region or a second region of a bonded wafer having a material different from silicon.
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