FILM INSPECTION METHOD, IMPRINT METHOD, MANUFACTURING METHOD FOR PATTERN STRUCTURE BODY, MOLD FOR IMPRINT, TRANSFER SUBSTRATE FOR IMPRINT, AND IMPRINT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a film inspection method for easily and accurately inspecting a film state in film formation, a film state after the formation, the residual amount in film removal, and the like; and an imprint method, a manufacturing method for a pattern structure body, an imprint device, a mold for imprint, and a transfer substrate for imprint which use the film inspection method.;SOLUTION: A film inspection method utilizes change of a dielectric constant between electrodes opposite to each other caused by change of a state of material positioned between the electrodes. The film inspection method detects a state of a film on a substrate from electric potential difference between a conductive unit, on which the film exists so as to be positioned at a predetermined part on the substrate, and a detection electrode arranged opposite to the conductive unit.;COPYRIGHT: (C)2015,JPO&INPIT