首页> 外国专利> ELECTROPLATING SOLUTION FOR FORMATION OF FLUORORESIN PARTICLE DISPERSED NICKEL PLATING FILM AND METHOD OF FORMING PLATING FILM USING THE SAME

ELECTROPLATING SOLUTION FOR FORMATION OF FLUORORESIN PARTICLE DISPERSED NICKEL PLATING FILM AND METHOD OF FORMING PLATING FILM USING THE SAME

机译:形成颗粒分散镍镀膜中氟树脂的电镀溶液及使用该溶液的镀膜方法

摘要

PROBLEM TO BE SOLVED: To provide means of forming a film having smoothness in a high eutectoid ratio in forming a nickel plating film dispersed with fluororesin particles by electroplating.SOLUTION: An electric nickel plating solution for forming a fluororesin particle dispersed nickel plating film by electroplating comprises a fluororesin particle and a fluorine-based surfactant having a perfluoroalkenyl group as a hydrophobic group and a quaternary ammonium bromine salt as a hydrophilic group.
机译:解决的问题:提供一种在电镀中形成分散有氟树脂颗粒的镍镀膜时,以高共析比形成光滑度高的膜的方法。氟树脂颗粒包括氟树脂颗粒和具有全氟烯基作为疏水基团和季铵溴盐作为亲水基团的氟基表面活性剂。

著录项

  • 公开/公告号JP2014224314A

    专利类型

  • 公开/公告日2014-12-04

    原文格式PDF

  • 申请/专利权人 BEST INC;

    申请/专利号JP20140083404

  • 发明设计人 NODA YASUHIRO;MATSUMURA MUNEYORI;

    申请日2014-04-15

  • 分类号C25D15/02;C25D3/12;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:16

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