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Composition for forming a passivation film comprising a resin having a carbon-carbon multiple bond

机译:用于形成钝化膜的组合物,其包含具有碳-碳多键的树脂

摘要

Provided is a passivation film that simultaneously achieves electrical insulation, heat resistance, solvent resistance, and dry etch back characteristics. The following formula (i): (wherein T0 is a sulfonyl group, a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or an arylene group optionally having a substituent and a fluoroalkylene group) Or a combination with a cyclic alkylene group.) Having a unit structure of formula (2-A), formula (2-B), or both at the terminal, side chain, or main chain of the polymer A composition for forming a passivation film, comprising a polymer having at least one group having the structure: The polymer may comprise a unit structure of the following formula (1): [Selection figure] None
机译:提供一种钝化膜,其同时实现电绝缘,耐热性,耐溶剂性和干法回蚀特性。下式(i):(其中T0是磺酰基,氟代亚烷基,环状亚烷基,具有取代基的亚芳基或任选具有取代基和氟代亚烷基的亚芳基)或与环的组合在聚合物的末端,侧链或主链上具有式(2-A),式(2-B)或两者的单元结构的用于形成钝化膜的组合物,其包含具有以下特征的聚合物:至少一种具有以下结构的基团:聚合物可以包含下式(1)的单元结构:[选择图]无

著录项

  • 公开/公告号JPWO2013118871A1

    专利类型

  • 公开/公告日2015-05-11

    原文格式PDF

  • 申请/专利权人 日産化学工業株式会社;

    申请/专利号JP20130557596

  • 发明设计人 田村 護;荻野 浩司;榎本 智之;

    申请日2013-02-08

  • 分类号C08G65/40;C08G75/23;H01L21/312;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:18

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