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Composition for forming a passivation film comprising a resin having a carbon-carbon multiple bond
Composition for forming a passivation film comprising a resin having a carbon-carbon multiple bond
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机译:用于形成钝化膜的组合物,其包含具有碳-碳多键的树脂
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摘要
There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i): T0-OFormula (i) (where T0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: The polymer may contain a unit structure of Formula (1): L1-O-T1-OFormula (1)
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