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COMPOSITION FOR FORMING PASSIVATION FILM INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND
COMPOSITION FOR FORMING PASSIVATION FILM INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND
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机译:包含碳-碳多键树脂的钝化膜形成组合物
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[Problem] A passivation film that simultaneously achieves electrical insulation, heat resistance, solvent resistance, and dry etch-back properties is provided. [Solution] The following equation (i): (Wherein, T 0 represents a sulfonyl group, a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or an arylene group which may have a substituent, or a combination of a fluoroalkylene group or a cyclic alkylene group. ) As a polymer containing a unit structure of the polymer, in the terminal, side chain, or main chain of the polymer formula (2-A), formula (2-B) Or, a composition for forming a passivation film comprising a polymer having at least one group having both structures. The polymer is represented by the following formula (1): It may include a unit structure of.
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